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pc814xj0000f series 1. recognized by ul1577, file no. e64380 (as model no. pc814 ) 2. approved by vde (din en60747-5-2 ( ? ) ) (as an op- tion), file no. 40008087 (as model no. pc814 ) 3. package resin : ul flammability grade (94v-0) ( ? ) din en60747-5-2 : successor standard of din vde0884 features agency approvals/compliance 1. programmable controllers 2. telephone sets, telephone exchangers 3. system appliances 4. signal transmission between circuits of different po- tentials and impedances applications dip 4pin ac input photocoupler 1. 4pin dip package 2. double transfer mold package (ideal for flow solder- ing) 3. ac input type 4. high collector-emitter voltage (v ceo : 80v) 5. current transfer ratio (ctr : min. 20% at i f = 1ma, v ce =5v) 6. high isolation voltage between input and output (v iso(rms) : 5.0 kv) 7. lead-free and rohs directive compliant ? 4-channel package type is also available. (model no. pc844xj0000f series ) description pc814xj0000f series contains an ired optically coupled to a phototransistor. it is packaged in a 4pin dip, available in smt gullw- ing lead-form option. input-output isolation voltage(rms) is 5.0kv. collector-emitter voltage is 80v and ctr is 20% to 300% at input current of 1ma. 1 sheet no.: d2-a03503en date sep. 1. 2006 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc814xj0000f series
internal connection diagram anode/cathode cathode/anode emitter collector 1 1 2 3 4 2 4 3 2 sheet no.: d2-a03503en outline dimensions (unit : mm) 1. through-hole [ex. pc814xj0000f ] 2. through-hole (vde option) [ex. pc814xnyj00f ] pc814 4.58 0.50 0.6 0.2 1.2 0.3 2.54 0.25 6.5 0.5 7.62 0.30 4.58 0.50 3.5 0.5 3.0 0.5 2.7 0.5 0.5 typ. primary side mark 0.5 0.1 0.26 0.10 : 0 to 13? epoxy resin 1 2 4 3 rank mark factory identification mark date code pc814 4.58 0.50 0.6 0.2 1.2 0.3 2.54 0.25 6.5 0.5 7.62 0.30 4.58 0.50 3.5 0.5 3.0 0.5 2.7 0.5 0.5 typ. primary side mark 0.5 0.1 0.26 0.10 : 0 to 13? epoxy resin 1 2 4 3 rank mark factory identification mark date code sharp mark "s" vde indenfication mark 4 3. smt gullwing lead-form [ex. pc814xpj000f ] pc814xj0000f series 0.6 0.2 1.2 0.3 6.5 0.5 7.62 0.30 0.26 0.10 4.58 0.50 2.54 0.25 epoxy resin 3.5 0.5 4.58 0.50 2.54 0.25 4 3 primary side mark rank mark factory identification mark date code 1.0 + 0.4 ? 0.0 1.0 + 0.4 ? 0.0 10.0 + 0.0 ? 0.5 0.35 0.25 1 2 pc814 product mass : approx. 0.22g product mass : approx. 0.23g product mass : approx. 0.23g plating material : sncu (cu : typ. 2%)
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production factory identification mark factory identification mark no mark country of origin japan indonesia philippines china * this factory marking is for identification purpose only. please contact the local sharp sales representative to see the actual status of the production. 3 repeats in a 20 year cycle rank mark refer to the model line-up table pc814xj0000f series sheet no.: d2-a03503en
electro-optical characteristics parameter conditions forward voltage peak forward voltage terminal capacitance collector dark current collector-emitter breakdown voltage emitter-collector breakdown voltage transfer charac- teristics collector current collector-emitter saturation voltage isolation resistance min. ? ? ? ? 0.2 6 80 ? 5 10 10 ? ? typ. 1.2 ? 30 ? ? ? ? 0.1 1 10 11 4 3 max. 1.4 3.0 250 100 ? ? 3.0 0.2 ? 18 18 unit v v pf na v v ma v ? s s symbol v f v fm c t i ceo bv ceo bv eco i c v ce (sat) t r t f r iso response time rise time fall time input output i f = 20ma i fm = 0.5a v = 0, f = 1khz v ce = 50v, i f = 0 i c = 0.1ma, i f = 0 i e = 10 a, i f = 0 i f = 1ma, v ce = 5v dc500v, 40 to 60%rh v ce = 2v, i c = 2ma, r l = 100 ? cutt-off frequency 15 80 ? khz f c v ce = 5v, i c = 2ma, r l = 100 ? , ? 3db floating capacitance ? 0.6 1.0 pf c f v = 0, f = 1mhz i f = 20ma, i c = 1ma (t a = 25?c) absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma *1 peak forward current a power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *2 isolation voltage operating temperature ?c storage temperature ?c *3 soldering temperature i f i fm p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 pulse width 100 s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1 minute, f=60hz *3 for 10s rating 50 1 70 80 6 50 150 200 ? 30 to + 100 ? 55 to + 125 260 5.0 kv 4 pc814xj0000f series sheet no.: d2-a03503en
model line-up 5 please contact a local sharp sales representative to inquire about production status. pc814xj0000f series i c [ma] (i f = 1ma, v ce = 5v, t a = 25?c) with or without rank mark a 0.2 to 3.0 0.5 to 1.5 pc814xj0000f pc814x1j000f through-hole pc814xnyj00f pc814x1yj00f sleeve ?????? approved model no. din en60747-5-2 package lead form pc814xpj000f PC814XP1J00F smt gullwing taping 100pcs/sleeve 2 000pcs/reel ?????? sheet no.: d2-a03503en
25?c 0?c 0 1 0.5 1.0 1.5 2.0 2.5 3.0 10 100 50?c ? 25?c forward voltage v f (v) forward current i f (ma) t a = 75?c fig.6 forward current vs. forward voltage duty ratio 10 100 10 ? 3 10 ? 2 10 ? 1 peak forward current i fm (ma) 1 10 000 1 000 pulse width 100 s t a = 25?c fig.5 peak forward current vs. duty ratio 6 pc814xj0000f series forward current i f (ma) ambient temperature t a (?c) 0 50 40 30 20 10 ? 30 0 25 50 55 75 100 125 fig.1 forward current vs. ambient temperature diode power dissipation p (mw) ambient temperature t a (?c) 0 100 80 70 60 40 20 ? 30 0 25 50 55 75 100 125 fig.2 diode power dissipation vs. ambient temperature collector power dissipation p c (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 30 0 25 50 75 100 125 fig.3 collector power dissipation vs. ambient temperature fig.4 total power dissipation vs. ambient temperature total power dissipation p tot (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 30 0 25 50 75 100 125 sheet no.: d2-a03503en
collector-emitter saturation voltage v ce (sat) (v) forward current i f (ma) 0 0 2 4 6 246810 1ma 3ma 5 3 1 9 7 5 3 1 5ma 7ma 11 12 13 14 15 t a = 25?c i c = 0.5ma fig.12 collector-emitter saturation voltage vs. forward current fig.11 collector dark current vs. ambient temperature 50 0 100 150 025 100 75 50 relative current transfer ratio (%) ambient temperature t a ( ?c ) ? 30 i f =1ma v ce =5v fig.9 relative current transfer ratio vs. ambient temperature ambient temperature t a (?c) collector emitter saturation voltage v ce (sat) (v) 0 ? 30 0.01 0 20 40 60 80 100 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.1 i f =20ma i c =1ma fig.10 collector - emitter saturation voltage vs. ambient temperature 7 pc814xj0000f series 0.1 1 10 0 60 80 100 120 140 20 40 forward current i f (ma) current transfer ratio ctr (%) v ce =5v t a =25?c fig.7 current transfer ratio vs. forward current 0 0 collector-emitter voltage v ce (v) 10 2 20 30 46810 20ma 10ma 5ma 1ma collector current i c (ma) t a = 25?c p c (max.) i f = 30ma fig.8 collector current vs. collector-emitter voltage 80 60 40 20 0 ? 30 100 10 ? 5 10 ? 6 10 ? 7 10 ? 8 10 ? 9 10 ? 10 10 ? 11 collector dark current i ceo (a) ambient temperature t a (?c) v ce = 50v sheet no.: d2-a03503en
frequency f (khz) 1 000 0 100 ? 1k ? 110 100 voltage gain a v (db) ? 20 ? 15 ? 10 ? 5 v ce = 5v i c = 2ma t a = 25?c r l = 10k ? fig.15 frequency response v cc r l output r d please refer to the conditions in fig.15. v ce fig.16 test circuit for frequency response remarks : please be aware that all data in the graph are just for reference and not for guarantee. 8 pc814xj0000f series v cc t f t r t s 90% 10% t d output input r l input output r d please refer to the conditions in fig.13. v ce fig.14 test circuit for response time 0.01 0.1 1 10 10 0.1 1 100 response time ( s) v ce = 2v i c = 2ma t a = 25?c t s t d t f t r load resistance r l (k ? ) fig.13 response time vs. load resistance sheet no.: d2-a03503en
design considerations while operating at i f <1.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 2.2 2.54 1.7 8.2 2.2 2.54 1.7 8.2 (unit : mm) design guide pc814xj0000f series sheet no.: d2-a03503en
manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) pc814xj0000f series sheet no.: d2-a03503en
solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbb and pbde are not used in this product at all. this product shall not contain the following materials banned in the rohs directive. ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated di- phenyl ethers (pbde). presence of odc 11 pc814xj0000f series sheet no.: d2-a03503en
sleeve package package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 100pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its primary side mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions package specification 12 (unit : mm) 12.0 6.7 5.8 10.8 520 2 pc814xj0000f series sheet no.: d2-a03503en
13 tape and reel package package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g b h h a c 5? max. dimensions list (unit : mm) a 16.0 0.3 b 7.5 0.1 c 1.75 0.10 d 8.0 0.1 e 2.0 0.1 h 10.4 0.1 i 0.40 0.05 j 4.2 0.1 k 5.1 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0.0 a 330 b 17.5 1.5 c 100.0 1.0 d 13.0 0.5 e 23.0 1.0 f 2.0 0.5 g 2.0 0.5 a c e g f b d dimensions list (unit : mm) pull-out direction [packing : 2 000pcs/reel] reel structure and dimensions direction of product insertion pc814xj0000f series sheet no.: d2-a03503en
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems rela- ted to any intellectual property right of a third party re- sulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the spec- ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufac- turing locations are also subject to change without no- tice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high lev- el of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall with- in the scope of strategic products described in the for- eign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp de- vices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, elec- tronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. 14 important notices pc814xj0000f series sheet no.: d2-a03503en [e188]

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